Rejoined LSI Logic as a Manufacturing Specialist, responsible for the operation and maintenance of Planarization equipment, key to the success of the CMP (Semiconductor) production line. Worked under contract through PrO Unlimited from August 02 until June 03.

As the high technology industry continued to experience a recession, applied my technical skills to this pulp and paper industry paper mill.

Was promoted from ILM Specialist to CMP Equipment Technician in October of 2000. Responsible for the technical performance of the CMP production line.

Duties included all maintenance tasks associated with the Speedfam/Ipec 776, 7700 cleaner, Strong arm Buff unit, and the Synergy Integra cleaner.

In January of 1999, was promoted to a Specialist position with the ILM department. Became certified on the JOEL SEM, KLA, AIT, Tencor, Ultrapointe, and maintained SME (subject matter expert) status on the DNS scrubber, sorter, Tencor, AIT, and the KLA2138 (and 2139). Duties included: running inspections, performing analysis on product that fails ILM learning limits or

spec, making decisions on whether or not to shut down tools which are causing failures, dispositioning lots which need scrap or rework, writing recipes on the KLA, and writing recipes on the AIT.

Began working at LSI Logic in the Gresham fab in January of 1998 as a machine operator. Started out in CMP and became certified in all CMP equipment. Also became proficient in rebuilding and replacing pads and carriers.

As Scheduler in the final cleanroom, duties include: interfacing with other schedulers and management personnel to assure smooth product flow, balancing manpower to equipment, and coordinating vacations, overtime, and meetings.

Additional responsibilities included: organization and training of designated trainers in accordance with current training policies, assisting engineering and maintenance in process and machine testing, assisting in a shared management work team to design product integrity processes, and training on safety precautions while working with this fully automated robotic polishing process.

Began as an operator in the lapping department and moved into a final inspect cleanroom, then to the polishing floor. Was promoted to Transitional Trainer for the start up of the South site wafer facility (3B).

Duties started out by receiving some pre-training from vendors in Japan and Texas, and writing theoretical work instructions. Received further training as equipment was being installed and was responsible for finalization of work instructions in accordance with MSA's ISO 9000 certification

Established this contract manufacturing business for part-time work out of the home. Specialized in small electronic assemblies requiring soldering and cable work. Provided direction and training to assemblers as needed. Responsible for the acquisition of manufacturing contracts.